Description

Between the dates listed above, the DARPA NGMM program will be actively reviewing the ERIS Marketplace for innovative, post-competitive, awardable solutions that exercise the early-stage version of the NGMM 3D Assembly Design Kit (3D-ADK) for mixed-material 3D-heterogeneously integrated (3DHI) microsystem design with commercial Electronic Design Automation (EDA) tools. This is an active and immediate search for solutions. Submissions will be reviewed on a rolling basis, and the Government reserves the right to make one or more awards prior to the closing date of this notice.

Classification

Contracting Office

Contacts

Attachments (1)

• Attachment 1