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Primary POC: Prateema Carvajal (prateema.carvajal@nist.gov) Secondary POC: Monica Brown (monica.brown@nst.gov) Title: Semiconductor market research service to provide data and markets in sectors relevant to the CRDO (CHIPS Research and Development (R&D) Office) and Open BAA (Broad Agency Announcement (BAA). – Combined Sources Sought/Notice of Intent to Sole Source BACKGROUND ***THIS IS A COMBINED SOURCES SOUGHT NOTICE AND NOTICE OF INTENT TO SOLE SOURCE*** The National Institute of Standards and Technology (NIST) is seeking information from sources that may be capable of providing Semiconductor market research subscription for support of the Broad Agency Announcement (BAA). If no alternate sources are identified, the Government intends to issue a Sole Source Award to Markets and Markets Research Private Limited (Level 1 Tower B5, SEZ, Magarpatta City, HADAPSAR, Pune, Maharashtra 411013, India) under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 519290 Web Search. NIST has a need for a software subscription for Semiconductor market research services that will provide information on specific, niche markets as well as broader technological areas. The information needed included: total addressable markets, CAGR, geographic location, competitors, and trends. software subscription, an online tool that provides research and analytical data about global venture capital to assess the security risks (e.g., foreign investments, and foreign-owned shell companies) posed by applicants to the various CHIPS R&D programs for support of the Broad Agency Announcement (BAA) meets or exceeds the following draft salient technical characteristics: Granular Material-Level Segmentation: Unlike general technology firms (e.g., Gartner, IDC) that track end-use devices, Markets and Markets provides deep-dive quantification of the semiconductor packaging materials market, including specific data on organic substrates, bonding wires, encapsulation resins, and thermal interface materials (TIMs). This data is essential for assessing the domestic manufacturing capacity of "sub-tier" components in the U.S. supply chain. Techno-Commercial Ecosystem Mapping: platform that maps the convergence of 5G, AI, and Advanced Packaging. Their unique Ecosystem Analysis identifies not only major players but also the niche Tier 2 and Tier 3 suppliers critical for government industrial base assessments. Proprietary Patent & Trade Analysis: Markets and Markets integrates patent publication trends and trade (import/export) data directly into their semiconductor reports. This multi-dimensional data is required to evaluate the competitive standing of U.S. research programs against global adversaries. Micro-Market Forecasting: The program requires Compound Annual Growth Rate (CAGR) data for emerging niche technologies like Fan-Out Wafer-Level Packaging (FOWLP) and High-Bandwidth Memory (HBM) materials. Other vendors typi…

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