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Die Bonding and Vacuum Packaging System | DEPT OF DEFENSE | FedOps

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CombinedClosed2View procurement thread

Die Bonding and Vacuum Packaging Systemview on SAM.gov

DEPT OF DEFENSE › NAVAL RESEARCH LABORATORY

Posted Jul 23, 2026

Due Aug 7, 2026

NAICS 333993 – Packaging Machinery Manufacturing

Sol # N0017326QKN05

Description

Please see attached combined synopsis/solicitation

Classification

PSC Code3540

Place of Performance

StateDC

ZIP20375

CountryUNITED STATES

Contracting Office

OfficeNAVAL RESEARCH LABORATORY

CityWASHINGTON

StateDC

ZIP20375-5328

Contacts

KEVIN NGUYEN

kevin.nguyen3.civ@us.navy.mil

Jamie Dixon(secondary)

jamie.l.dixon8.civ@us.navy.mil

Attachments (2)

Attachment 1
Attachment 2

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