Notice of Intent to Noncompetitively acquire upgrade a 3D Digital Image Correlation (DIC) System. This notice is not a request for a quotation. A solicitation document will not be issued, and quotations will not be requested. This acquisition is being conducted under the authority of FAR 12.102(b). The North American Industry Classification System (NAICS) code for this acquisition is 334516, Analytical Laboratory Instrument Manufacturing which has a small business size standard of 1,000 employees. The NIST Infrastructure and Materials Group within the Engineering Lab, representing the CHIPS R&D Grand Challenge 3, has a requirement at its Gaithersburg, Maryland campus for a high-performance 3D DIC system. This system will precisely measure in-situ, full-field displacement and strain of polymeric packaging compounds (e.g., underfills redistribution layers, and thermal interface materials) under various thermal and mechanical loading conditions. This will meet the mission of enabling the characterization of advanced packaging integration and providing new open-source reliability tools. In order to realize this mission, NIST requires a 3D DIC system that meet all minimum technical specifications identified below: Line Item 0001: Description: 3D DIC System (Cameras, Controller, Software, and Workstation) (Quantity: 1 System) Imaging Device (Camera and Sensor) Specifications Must include at least 4 cameras of 12-megapixels or higher resolution. Minimum resolution of 4096 x 3000 pixels. Frame rate Minimum frame rate of 25 Hz at full resolution (e.g., 4096 x 3000 pixels). Extendable for full-format measuring areas of variable dimension (e.g., 20 x 15 mm2 to 1800 x 1500 mm2). Specify area limits. Measuring Volume and Lens Specifications Specify working distance (e.g., 350 mm). Local measurements Local measuring area, number of lenses, and focal length must be specified. Specify supported measurement area range limits. Preferred measurement area of approximately 30 x 25 mm2 to 250 x 180 mm2. Must be able to provide measurement of interposer structure. Global measurements Global measuring area, number of lenses, and focal length must be specified. Specify supported measurement area range limits. Preferred measurement area of approximately 65 x 50 mm2 to 650 x 480 mm2. Must be able to provide measurement of larger samples including larger assembly of test structures. Calibration objects System must include calibration objects suitable for a variety of measuring area ranges. Specify number of calibration objects and their associated measuring area ranges. Illumination and Projection Specifications LED illumination: Dual LED panels suitable for continuous operation Speckle-free capability: The system must include a digital pattern projector (LCD or similar) to project controlled, non-physical speckle patterns onto reflective/monotonic surfaces for warpage measurement. Controller Analog data acquisition: Must include an analog data acquisition system. Specify…