Call 1 – Secure Enclave Chipletsview on SAM.gov

CALL 1 – SECURE ENCLAVE CHIPLETS This Broad Agency Announcement (BAA) Call solicitation is issued in accordance with the Revolutionary Federal Acquisition Regulation Overhaul (RFO) subpart 35.102. NAICS Code: 541713, Nanotechnology research and development laboratories or services, all fields of science Federal Agency Name and Contracting Officers: SAF/AQC, Ms. Natalie Sitkowski natalie.sitkowski@us.af.mil SAF/AQC, Ms. Dimitria Antonopoulos, dimitria.antonopoulos@us.af.mil SAF/AQC, Mr. Stephen Colvin stephen.colvin.2@us.af.mil Technical POC: SAF/AQ: Mr. Matthew Karijolic matthew.karijolic@us.af.mil Broad Agency Announcement Title: This is a combined synopsis/solicitation under the State-of-the-Art (SOTA) Microelectronics Adoption BAA. Call 1, titled “Secure Enclave Chiplets” Broad Agency Announcement Number: 26-S-1358, Call 001 (Secure Enclave Chiplets) Broad Agency Announcement Type: This is the initial announcement for Call 1. This will be a Two-Step Call solicitation. Step 1: WHITE PAPER DUE DATE AND TIME: White Papers will be accepted until 23 Jul 2026 at 5:00pm Eastern Time (ET) . White Papers may be submitted at any time during this period. White Papers received after the specified date and time will be considered late in accordance with RFO 52.215-1(c)(3) and will not be reviewed. Questions pertaining to this Call may be submitted for the USG's consideration NLT 15 July 2026 at 5:00pm ET . Please email all questions to SE_PI@us.af.mil . Step 2: FULL PROPOSAL DUE DATE AND TIME: To be provided in the Requests for Proposal (RFP) sent to Offerors that submit White Papers considered to be of further interest to SAF/AQC. Full Proposals received after the specified date listed in a formalized Step 2 RFP and time will be considered late. Submission POC: White Papers must be submitted via email to SE_PI@us.af.mil . FULL TEXT – CALL 1 (Secure Enclave Chiplets) SECURE ENCLAVE CHIPLETS OVERVIEW The Department of War (DOW) invites Offerors to submit Pilot Project chiplet designs with innovative and novel technical solutions which address all aspects of SOTA microelectronics and composable systems, focusing on the Secure Enclave Chiplets objectives below. This requires delivering enduring, secure, interoperable, and highly reusable chiplet architectures tailored for High-Demand Mission Areas (e.g., Radio Frequency/Electronic Warfare (RF/EW), munitions, security, and/or autonomy). Many DOW microelectronics projects operate in varying classification environments, including highly classified environments (collateral, Sensitive Compartmented Information, and Special Access Programs). The USG intends for much of the development to occur at the UNCLASSIFIED or Controlled Unclassified Information (CUI) level. Notice of intent to perform classified work as a result of this Call must be provided to the USG Contracting Officer. If the Offeror intends to perform any classified work, it must be done so at their facility (or a subcontractor/sub-awardee's facility…